Zhaoxin KaiXian ZX-C processor win China Semiconductor Innovation and Technology Award (2017.03.28)
After winning China International Industry Fair gold award and 2016 innovation and technology award, Zhaoxin KaiXian ZX-C processors won another prize on 2017 china semiconductor annual conference. All these show that Zhaoxin’s contribute a lot to semiconductor industry.
General processor is a representative of technology intensive products in semiconductor industry and play a key role in cyber technology development.
As a big manufacturing nation of IT industry, we need to step forward on domestic general processors. Zhaoxin is the only domestic company owning the interlocutory practice for all three of the major core technologies, namely, central processing unit (CPU), graphics processing unit (GPU) and chipset. Zhaoxin will improve this situation as soon as possible.
Zhaoxin KaiXian ZX-C processor win the 11th China Semiconductor Innovation and Technology Prize
As an independent innovation result of National Science and Technology Major Project, Zhaoxin ZX-C series processor has a full design by ourselves. KaiXian ZX-C series processors are compatible with x86 instruction sets, frequency up to 2.0GHz. Compatible with full series of Windows and many domestic operating systems such as NFS-China, NeoKylin and etc., capable of supporting CPU virtualization technology (VT). Variety brands of products based on KaiXian ZX-C series processors have reached first-class standard and have a MTBF of 100,000 hours.
The media conclude that the whole performance of ZX-C PCs is satisfied with daily office work and light entertainment demand. Zhaoxin ZX-C series processors are currently the only domestic CPU can completely replace foreign products of the same type. Zhaoxin KaiXian ZX-C series processors won gold award in the 18th China International Industry Fair, Nov. 2016.
Kaixian ZX-C series processor win gold award in 18th China International Industry Fair
Currently, Zhaoxin has built a complete domestic ecosystem that include chip R&D, enveloping and manufacturing, system and software development, computer manufacturing, office system integration and service etc.